P&A offers variety of PCB's from single to double sided, multi-layer Printed Circuit Boards and the latest materials and processes. We have dedicated branches specializing in different types of Printed
Circuit Boards to optimize for cost and leadtime. We offer prototype PCB services, quick lead-time PCB runs and no minimum order quantity!
We focus to deliver quality PCB's at a low cost – more so than from any other PCB manufacturer. Our management office in Hong Kong allows us to provide world class customer service with experienced engineers to quickly process orders for production in mainland China. Our factories located in southern China and deliver low cost and high quality product. In fact, we’re among the best PCB manufacturer China has to offer.
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This custom aluminum backplate PCB was a project completed for European car parts manufacturing firm that specialise in lighting products. Blind slot Aluminum plate PCB filled with resin. Suitable for high power applications and through-hole mounted components
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Aluminum plate PCB was developed for medical equipment manufacturer. Aluminium back-plate thickness is 1.6mm, single sided aluminum plate, Laird laminate, copper thickness is 2oz, gold immersion. |
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Aluminum plate PCB was developed for Airbus 380, used as a part of monitor build in in to the seat. Aluminium back-plate thickness is 1.6mm, single sided aluminum plate, Berquist laminate, copper thickness is 4oz, gold immersion, dielectric thickness is 0.075mm |
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This custom aluminum backplate PCB was a project completed for European car parts manufacturing firm that specialise in lighting products. Blind slot Aluminum plate PCB filled with resin. Suitable for high power applications and through-hole mounted components |
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Custom project with anodized and engraved aluminum base plate PCB. Aluminum thickness is 1mm, 4oz Copper thickness, single-sided PCB. Engraving of logo done with laser, OSP finish and Bergquist laminate. Application is power supply module for custom device |
Below chart is representation of the work flow in manufacturing of multilayer metal based Printed Circuit Boards. Process is involved and many aspect are critical making it challenging. Aluminum and Copper plate PCB are complex structures that are difficult to manufacture and maintain high quality consistently. This is why our facility is audited by best people in business from Japan. By maintaining high degree of awareness and continuous training of employees we achieve reliable high quality manufacturing process.
We offer three types of Printed Circuit Board assembly technologies: manual insert, SMT and integrative assembly. Electronic components population include general insert component, SIP, DIP, QFP and BGA. P&A is your one stop shop for PCBA manufacturer needs:
-We offer all types of PCB manufacturing technologies
-We also offer manual assembly and wave soldering
-Manufacturing Printed Circuit Boards in small and high quantities
-Defective PCB ratio is below 0.1%
-We are able to mount parts of all usual sizes ( BGA, μBGA, Flip Chips, CSP)
-We assist you with development of printed circuit boards and do small production runs of prototypes
-Numerous testing methods are available
-We undertake the purchasing of parts, quality assurance, packaging, logistics
-We warranty our product
-We advice on cost reduction opportunities
-Flexible and fast delivery
-Visual control
-Flying probe
-AOE automatic optical control equipment
-IC-T
-FC-T
-X-ray control
-Custom PCBA functionality testing
-Custom PCBA environmental testing (thermal, humidity, vibration)
We work with manufacturers that hold current ISO, UL, VDE, RosH and TÜV certificates. Our day to day inspection and testing go beyond the requirements of the certification. We work closely with our customers making necessary changes to testing and production based on there's feedback.
-Programming
-Testing
-Varnish coating
-Draining
-Turnkey assembly
-Leadfree or “Military” grade leaded soldering
-Aluminum PCB assembly
-Gold and Silver Plated PCB
Ordering Quantity: Due to the MOQ requirement of chip electronic components, to get best possible price order quantity is suggested to be at least 5~10kpcs when mass produced.
Technical data: When you forward production file, keep it as detailed as possible. We need at least to have a PCB Gerber file with any special assembly requirements note included.
Most electronics manufacturers have converted their stocks of parts to Sn (Tin) finish parts that are ROHS compliant. However, it is still the customers option to choose ROHS compliant production or to allow tin/lead solder and board finishes. The tin/lead solder and board finishes are required for military PCBA's. There is a slight cost reduction in producing tin/lead finish Printed Circuit Boards. ROHS compliance must start at the design stage of your project with selection of ROHS compliant parts. All our quotes include PCB’s that ROHS compliant by default.
THT Assembly
At Through Hole Technology the pins ‘legs” of the parts (which may be fix or flexible) are placed in the predrilled holes on the printed circuit board and soldered on the other side of the PCB. Wave soldering is used for this process.
The main disadvantage of this technology is the fact, that both sides of the PCB used by the components.
SMT - SMD Assembly
During Surface Mount Technology the pins of the components placed over copper pads on the PCB. Legs of the components are in direct contact with the copper surfaces on the PCB.
Advantages of the SMT Assembly:
-There is no need to create holes on in the printed circuit board
-The costs of the production process can be reduced and the process can be automated
-More practical as the PCB requires less space for components placement
Variations of SMT Assembly:
-Pure surface assembly - only SMD parts are used for assembly
-one-side surface assembly (REFLOW)
-two-sides surface assembly (double REFLOW)
-Mixed assembly – both SMD and traditional parts are used for assembly
-On one side SMD, on the other side (RAD-CP)
-In case of mixed surface assembly (REFLOW-RAD-CP)
BGA Assembly:
BGA mounting technology allows parts to be assembled on the PCB, which could not be mounted using another technology due to their size or complicated pin-out.
The most common IC methods are QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), QFJ (Quad Flat J-leaded package) and BGA (Ball Grid Array). There is a significant difference between BGA and QFP technology, as at BGA the outputs of the components placed the bottom of the part.
The main disadvantage of the BGA technology is the fact that analyzing the faults and repairing them has become more complicated as the soldering point are hidden and can only be inspected using x-ray tests.